TY  - BOOK
AU  - Bailey,Christopher
AU  - Liu,Johan
ED  - ProQuest (Firm)
TI  - Advanced manufacturing process, lead free interconnect materials and reliability modeling for electronics packaging
T2  - Soldering & surface mount technology
AV  - TK7870.15 .A48 2006
PY  - 2006///
CY  - Bradford, England
PB  - Emerald Group Publishing
KW  - Manufacturing processes
KW  - Electronic packaging
KW  - Electronic books
N1  - Electronic reproduction. Ann Arbor, MI : ProQuest, 2015. Available via World Wide Web. Access may be limited to ProQuest affiliated libraries
UR  - http://ebookcentral.proquest.com/lib/aitie/detail.action?docID=267393
ER  -