TY  - BOOK
AU  - Mittal,K.L.
AU  - Ahsan,Tanweer
TI  - Adhesion in microelectronics
T2  - Adhesion and Adhesives: Fundamental and Applied Aspects
AV  - TK7870.15 .A3236 2014
U1  - 621.381/046 23
PY  - 2014///
CY  - Hoboken, New Jersey, Salem, Massachusetts
PB  - Scrivener Publishing, Wiley
KW  - Microelectronic packaging
KW  - Materials
KW  - Adhesives
KW  - Adhesive joints
KW  - Electronic books
N1  - Includes bibliographical references and index
UR  - http://ebookcentral.proquest.com/lib/aitie/detail.action?docID=1767917
ER  -