Modeling and simulation for microelectronic packaging assembly [electronic resource] : manufacturing, reliability and testing / Sheng Liu, Yong Liu.
Material type: TextPublication details: Hoboken, N.J. : Wiley, 2011.Description: xxii, 564 p. : illSubject(s): Genre/Form: DDC classification:- 621.381/046 23
- TK7870.15 .L58 2011
Item type | Current library | Call number | Status | Date due | Barcode | |
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Ebook | TUS: Midlands, Main Library Athlone Online | eBook (Browse shelf(Opens below)) | Available |
Includes bibliographical references and index.
pt. 1. Mechanics and modeling -- pt. 2. Modeling in microelectronic packaging and assembly -- pt. 3. Modeling in microelectronic package reliability and test -- pt. 4. Modern modeling and simulation methodologies : application to nano packaging.
"This book is primarily concerned with studies of electronic packaging in assembly manufacture processes and failure mechanisms in assembly manufacture processes and tests through modeling and simulation"-- Provided by publisher.
Electronic reproduction. Ann Arbor, MI : ProQuest, 2015. Available via World Wide Web. Access may be limited to ProQuest affiliated libraries.