Design and modeling for 3D ICs and interposers / Madhavan Swaminathan, Ki Jin Han. [electronic resource]
Material type:
TextSeries: WSPC series in advanced integration and packaging ; v. 2.Publisher: Singapore ; Hackensack, New Jersey : World Scientific Publishing Company, [2014]Copyright date: ©2014Description: 1 online resource (379 pages) : illustrationsISBN: - 9789814508605 (e-book)
- TA168 .S93 2014
| Item type | Current library | Call number | Status | Date due | Barcode | |
|---|---|---|---|---|---|---|
| Ebook | TUS: Midlands, Main Library Athlone Online | eBook (Browse shelf(Opens below)) | Available |
Includes bibliographical references and index.
Description based on online resource; title from PDF (ebrary, viewed December 30, 2013).
Electronic reproduction. Ann Arbor, MI : ProQuest, 2015. Available via World Wide Web. Access may be limited to ProQuest affiliated libraries.