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Advanced manufacturing process, lead free interconnect materials and reliability modeling for electronics packaging

Advanced manufacturing process, lead free interconnect materials and reliability modeling for electronics packaging [electronic resource] / guest editors Christopher Bailey and Johan Liu. - Bradford, England : Emerald Group Publishing, c2006. - 72 p. - Soldering & surface mount technology ; v.18, no. 2 .

Electronic reproduction. Ann Arbor, MI : ProQuest, 2015. Available via World Wide Web. Access may be limited to ProQuest affiliated libraries.

ISBN:

Subjects--Topical Terms:
Manufacturing processes.
Electronic packaging.

Index Terms--Genre/Form:
Electronic books.

LC Class. No.: TK7870.15 / .A48 2006

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